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Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
SKU
HTK-002-U1-GP
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
| SKU | HTK-002-U1-GP | ||||||||||||||||||||||||||||||||||||||||||||
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| EAN | 4719512002940 | ||||||||||||||||||||||||||||||||||||||||||||
| Specification |
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| Manufacturer | Cooler Master | ||||||||||||||||||||||||||||||||||||||||||||
| In Stock | Y | ||||||||||||||||||||||||||||||||||||||||||||